Engineering Resources:   Technical Specifications

Electrical Specifications：
Specification Value
Rated Continuous Current up to 50A, or even 60A，
Peak / Pulse Current up to 80A, or even 100A，
Rated Operating Voltage up to 550 V, custom 5,500V.
Initial Contact Resistance 10–100 mΩ,
Contact Resistance as low as 10 mΩ,
Contact Resistance After Cycling ≤50 mΩ,
Insulation Resistance ≥1,000 MΩ.
Dielectric Withstanding Voltage 500 VDC test,
Temperature Rise <30°C in 5 minutes,
Electrical Continuity Continuous engagement.
Inductance <0.3nH,
Capacitance <0.2pF,
Characteristic Impedance 50Ω, 50Ω / 100 Ω differential designs,
S11 < 0.5dB，
S21 > -1dB,
Crosstalk < -25 dB, custom 20 dB to -40 dB,
Hot-Plug LMFB or FMLB,
ESD System-level protection.

Mechanical Specifications：
Specification Value
Barrel Diameter Ø1.50 mm. or   ≥Ø0.15 mm,
Plunger Diameter Ø0.90 mm. or   ≥Ø0.08 mm,
Free Length 5.00 mm. or   ≥1.40 mm,
Working Height 4.00 mm. or   ≥1.20 mm,
Mechanical Stroke 1.50 mm. or   ≥0.10 mm,
Recommended Working Stroke 1.00 mm.
Minimum Compression 0.50 mm. or   ≥0.10 mm,
Maximum Compression 1.20 mm. or   ≥0.10 mm,
Pin Pitch 2.54 mm. or   ≥1.00 mm,
Contact Tip Diameter Ø0.80 mm. or   ≥Ø0.08 mm,
Contact Tip Geometry Rounded / Flat   / Crown / Conical / Custom,
Barrel Wall Thickness ≥0.15 mm.
Plunger Guidance Clearance ±0.01mm, ±0.007mm, ±0.005mm,
Housing Length ≥3.00 mm,
Housing Width ≥2.00 mm,
Housing Height ≥1.38 mm,
Contact Position Accuracy ±0.05 mm,
Pin Height Coplanarity ≤0.05 mm,
Axial Alignment ±0.1°,
Angular Misalignment 0° or self   alignment,
Lateral Offset Allowance 0.10 mm
Maximum Side Load 0 N, or random load based on ball point pogo pin,
Retention Force 5 N per pin,
Total Mating Force 0.8 N x pin count,
Total Unmating Force 0.5 N per pin,

Spring Force and Motion：
Specification Value
Initial Contact Force 0.15 N, or 0.05–0.80 N
Force at Working Stroke 0.80 N at 1.00 mm, or ≥0.05 N
Force at Max Compression ≥0.50 N,
Spring Rate 0.20–1.50 N/mm,
Force–Stroke Curve Linear over working range,
Contact Force Variation ±20%,
Spring Preload 0.05–0.80 N
Permanent Set ≤0.05 mm,
Spring Material SUS631, SUS304, BeCu, SWP-B,
Force Attenuation <5% after 100,000 life cycles,
Life Cycles 10,000–500,000 cycles,
Return Height 5.00 mm free height, custom,
Sliding Friction Dual springs for spring force ≥0.10N at ≥0.1mm,
Plunger Sticking No sticking,
Overtravel Max compression, housing-limited.

Materials and Surface Finish：
Specification Value 
Plunger Base Material Brass, BeCu, TeCu, Phosphor Bronze, SUS303/304, SUS316L/F, others,
Barrel Base Material Brass, BeCu, TeCu, SK4, Phosphor Bronze, SUS303/304, SUS316L/F,
Spring Material SWP-B, BeCu, SUS631, SUS304
Pin Plating Gold over nickel, Au, Ag, Rh, Ru, Pd, Pt, Cu-Sn-Tin, composite plating,
Gold Plating Thickness Up to 5.0 µm,
Nickel Underplate Thickness 1.25–3.00 µm,
Plating Hardness  ASTM B 488,130 – 200 HK₂₅
Plating Porosity 100-300 holes/cm²，or <100 holes/cm²，
Surface Roughness <Ra 0.8 µm,
Mating Surface Material Gold-plated PCB pad or target pin,
Mating Surface Finish Gold finish or refer to pin plating above.
Housing Material LCP, PA46, PA9T, PA6T, HTN, PBT, PEEK, PPSU, PEI, PPE, PS, ISO10993
Housing Flammability UL 94 V-0,
Material Conductivity up to continuous 50A as low as 15 mΩ,
Material Hardness BeCu 400 HV, brass 62-175 HV,  Au 200 HV, Pd 650 HV,  Rh/Ru 700 HV,
Corrosion Resistance Duration in 5% salt solution: 24h, 48h, 72h, 96h, 120h,
RoHS Yes, RoHS（2015/863/EU）
REACH Yes, REACH, SVHC,
Traceability Material L/C,  finish L/C, production D/C, inspection records.

PCB and Assembly   Specifications
Specification Value 
Mounting SMT, Through-Hole, Right Angle, 90° Bending PTH, Press-Fit, Solder-Cup
Pad Diameter 0.20-0.40 larger than pin tail diameter,
Pad Pitch ≥1.00 mm,
PCB Thickness 1.20–1.30 mm pin length for 1.00mm PCB, 1.80–1.90 mm pin length for 1.60mm PCB,
Hole Diameter 0.20-0.40 larger than pin tail diameter,
Hole Position It’s based on   ≥1.00 mm pitch,
Soldering Process SMT reflow, wave soldering 260℃ <7s, manual PTH 340℃ 3s. Standard N52 magnetic   connectors avoid reflow and wave soldering.
Peak Temperature 260°C <7s,
Reflow Cycle Count Up to 2 times,
Solder Joint Strength ≥ 5N, Solder climbing height 1/2-3/4 of tail pin,
SMT Coplanarity ≤0.10 mm,
Pick-and-Place 50–100 gf, proposed accuracy ±0.03 mm,
Packaging Tape-and-reel, PE bag Bulk,
Pad Flatness Ra < 0.4 μm,

Environmental and Reliability   Specifications
Specification Value
Operating Temperature −40°C to +85°C, custom continuous 350℃,
Storage Temperature −40°C to +85°C,
Mechanical Cycle Life Typical 50,000 cycles. 10,000–500,000 cycles
Temperature Cycling -40°C to +85°C  for 5 times, -40°C to +85°C +10%RH~90%RH for 10 times,
High-Temperature Storage +85°C, 96hours,
Damp Heat Exposure +60°C + 90%RH–95%RH, 96hours,
Salt Spray Exposure 5±1% salt, 35±2°C, continuous 48 hours, or 24h, 96h, 120h,
Vibration Resistance 10G, vibration, 10–55–10 Hz/minutes, 1.5mm amplitude at 0.1A.
Mechanical Shock 50G at 0.1A, 11ms,
Contact Interruption ≤1μs @0.5A + >1.15V
Wear Resistance 10,000 cycles, 50,000 cycles, 100,000 cycles based on hard gold plating,
Corrosion Performance Salt spray 48hours, 96hours, 120hours,
IP Protection Rating IP67, IP68
Chemical Resistance Sweat resistant >168hours, cosmetics resistant to electrolytic corrosion,
Dust Contamination Resistance IP6x reduce dust by >92%,
UV Exposure Resistance 50mΩ based on gold plating and insulation housing,
Thermal Aging 132–228 hours at 105°C, or 168 at 85°C, ≤10 mΩ by LLCR,
Reliability Acceptance Check contact resistance, cosmetic, instantaneous interruption,
Qualification Sample Size 5 or 10pcs samples,
Test Report Identification Model, P/N, testing date, testing standard/method, sample quantity, testing conditions, instrument and equipment information, measured data, judgment conclusion, testing   personnel/auditors

Multi-Pin Connector and Custom
Specification Value 
Number of Contacts 1, 2, 3 – 4,400pins, custom,
Pin Arrangement Single, Dual, Circular, Matrix, Custom,
Power / Signal Integration Power, GND, Data, Signal (I2C, CAN, RJ45,) Detection, Control,   LMFB, FMLB,
Pitch ≥1.00mm,
Tolerance ±0.01 mm,  ±0.007 mm,  ±0.005 mm,
Housing Tolerance ±0.15 mm,
Mating Orientation Vertical, Horizontal, Angled
Polarization / Keying Magnetic, keyed housing, asymmetric housing,
Floating Alignment Yes, absorb tolerances and misalignment to prevent contact   separation,
Magnetic Alignment Yes, >5gf per pin, keyed housing with S/Z-pole,
Sealing IP67/IP68 with Gasket, O-ring, Injection Molding, Overmolding,
Mating Force Spring force per pin x pin count+magnetic force,
Retention ≥300 gf per pin,
Shielding / Grounding EMI, signal integrity with foil shielding or braided shielding,
Housing Color / Marking Black, White,
Tip Geometry Rounded, Flat, Crown, Conical, Concave, Custom
Spring ≥5 gf per pin,
1. Prototype Verify connector X/Y/Z and angle, minimum/nominal/maximum compression, solder joint quality, plunger movement. And verify contact resistance, continuous current and voltage,   magnetic force, and mechanical load.
2. Verification Johoty verifies contact resistance, voltage drop, temperature rise, and continuity. Johoty guarantees magnetic retention force,   separation force, spring force, and retention force. We verify pogo pin connector performance under temperature, humidity, vibration, impact, and dust/water. We finalize the maximum resistance change, allowable force range,   and maximum instantaneous break time.
3. Acceptance Based on AQL, PC-A-610, and   ISO9001,  we can confirm the accurate size, standard signal pin <30mΩ, and high-frequency/high current <10mΩ.   We can guarantee the smoothness of spring force, plunger stroke, and coating uniformity.
4. Change Control Johoty can follow up on ECOs about pogo pin structure, spring material or force, substrate or coating. And we keep the right magnet or coating, housing, adhesive, wire gauge. We align with clients about PCB   surface treatment, mold/fixture/equipment, production location transfer, etc.   We can timely cope with notification, approval, and isolation for new and old materials.